Material-efficient Cu wire-based 3D printing technology

Area Acceleration (D2) Segment Upscaling (D2.2) Duration 2019/01/01-2021/12/31

News

2024 Kaohsiung International Invention & Design EXPO (KIDE)

24 stycznia 2025

Place: Kaohsiung, Taiwan Date: 5-12 December 2024 Gold medal for Technology for manufacturing feedstock materials for applications in 3D printing…


3D Printing Conference

24 stycznia 2025

Place: London Date: 7 – 8 October 2024 The project results were presented during poster session at this event dedicated to…


XX International Fairs EXPO Katowice

24 stycznia 2025

Place: Katowice Date: 04 – 06 September 2024   The International Fairs EXPO KATOWICE is the largest heavy industry fair…


Innowator Śląska

14 grudnia 2022

Date: 25th November 2022 Place: Gliwice The idea of the Competition is to promote and reward the most innovative entities…


Formnext 2022

14 grudnia 2022

Date: 15-18th November 2022 Place: Frankfurt am Main Formnext is one of the biggest and most renowned fairs on Additive…


Global Conference on 3D Printing and Additive Manufacturing

14 grudnia 2022

Date: 10-11 November 2022 Place: Valencia, Spain This conference focuses on 3D Printing and Additive Manufacturing so it was a…


Project Partners

Łukasiewicz Research Network - Institute of Non-Ferrous Metals

  • Development of the Cu-based alloys
  • Development of production technology of feedstock materials for WAAM
  • Wire arc additive manufacturing at laboratory scale
  • Materials investigations

Ghent University

  • Corrosion-fatigue investigations
  • Tests of the prototypes in seawater environment
  • Educational activities

Italian National Agency for New Technologies, Energy and Sustainable Economic Development

  • Material investigations
  • Mechanical proporties

Gefertec GmbH

  • Development of the production process parameters by means of 3DMP technology
  • Implementation of the results of the project (end user)
  • Manufacturing of the new products

Tecnalia Research and Innovation

  • Erosion tests
  • Non-destructive tests

Supported by