28th International Defence Industry Exhibition MSPO - 3DMPWIRE - Material-efficient Cu wire-based 3D printing technology

Date: 8-10 September 2020

Place: Kielce

In September representatives of the Project Consortium took part in the International Defence Industry Exhibition in Kielce. It was an occasion to present the up to date results of the project and promote it as well as to make new contacts.

Working with Gefertec

SAAM (Silesia Automotive & Advanced Manufacturing)

Project Partners

Łukasiewicz Research Network - Institute of Non-Ferrous Metals

Development of the Cu-based alloys
Development of production technology of feedstock materials for WAAM
Wire arc additive manufacturing at laboratory scale
Materials investigations

Ghent University

Corrosion-fatigue investigations
Tests of the prototypes in seawater environment
Educational activities

Italian National Agency for New Technologies, Energy and Sustainable Economic Development

Material investigations
Mechanical proporties

Gefertec GmbH

Development of the production process parameters by means of 3DMP technology
Implementation of the results of the project (end user)
Manufacturing of the new products

Tecnalia Research and Innovation

Erosion tests
Non-destructive tests

28th International Defence Industry Exhibition MSPO 21 września 2020