Material-efficient Cu wire-based 3D printing technology
Area Acceleration (D2) Segment Upscaling (D2.2) Duration 2019/01/01-2021/12/31
Material-efficient Cu wire-based 3D printing technology
Area Acceleration (D2) Segment Upscaling (D2.2) Duration 2019/01/01-2021/12/31
Date : 19th – 21st October 2021
Place: Kielce
On October the 19th – 21st 2021, the 16th International Fair of Aluminium & Technology, Materials and Non-Ferrous Metal products ALUMINIUM & NONFERMET was held in Kielce. During this event, companies offering new technologies, modern machines and devices used in the non-ferrous metal industry, as well as raw materials, components and materials used in metallurgical processes presented their offer. The representatives of Łukasiewicz – The Institute of Non-Ferrous Metals who took part in the exhibition presented WAAM 3D printing technology and the 3DMPWire project. They showed the wires manufactured in the Institute dedicated to WAAM 3D printing and also the printed samples.
