Innovat&Match Brokerage Event 2021 R2B - 3DMPWIRE - Material-efficient Cu wire-based 3D printing technology

Date: 17th June 2021

Place: Faenza

On the 17th of June 2021 an online Innovat&Match Brokerage Event 2021 R2B, during which our project was presented. Also the results of tests carried out within WP4 were discussed.

Symposium: Development of high-energy materials, current state and prospects

Working meeting with Gefertec

Project Partners

Łukasiewicz Research Network - Institute of Non-Ferrous Metals

Development of the Cu-based alloys
Development of production technology of feedstock materials for WAAM
Wire arc additive manufacturing at laboratory scale
Materials investigations

Ghent University

Corrosion-fatigue investigations
Tests of the prototypes in seawater environment
Educational activities

Italian National Agency for New Technologies, Energy and Sustainable Economic Development

Material investigations
Mechanical proporties

Gefertec GmbH

Development of the production process parameters by means of 3DMP technology
Implementation of the results of the project (end user)
Manufacturing of the new products

Tecnalia Research and Innovation

Erosion tests
Non-destructive tests

Innovat&Match Brokerage Event 2021 R2B 30 lipca 2021