Material-efficient Cu wire-based 3D printing technology

Area Acceleration (D2) Segment Upscaling (D2.2) Duration 2019/01/01-2021/12/31

Kielce Trade Fairs 13 kwietnia 2019

Date: 27-28 March, 2019
Place: Kielce, Poland

As part of this year’s edition of the fair, in addition to a very wide presentation of modern machines and devices in the field of the broadly understood subject of processing and processing of materials, another 11th edition of 3D Printing Days took place.

This event is the oldest and the most important meeting of representatives of the 3D printing industry in Eastern Europe and Poland. As part of this event, the Non-Ferrous Metals Institute promoted the 3DMPWire project through the presentation of the project Roll-up, thus establishing new contacts with representatives from the trade.

Project Partners

Łukasiewicz Research Network - Institute of Non-Ferrous Metals

  • Development of the Cu-based alloys
  • Development of production technology of feedstock materials for WAAM
  • Wire arc additive manufacturing at laboratory scale
  • Materials investigations

Ghent University

  • Corrosion-fatigue investigations
  • Tests of the prototypes in seawater environment
  • Educational activities

Italian National Agency for New Technologies, Energy and Sustainable Economic Development

  • Material investigations
  • Mechanical proporties

Gefertec GmbH

  • Development of the production process parameters by means of 3DMP technology
  • Implementation of the results of the project (end user)
  • Manufacturing of the new products

Tecnalia Research and Innovation

  • Erosion tests
  • Non-destructive tests

Supported by