Material-efficient Cu wire-based 3D printing technology

Area Acceleration (D2) Segment Upscaling (D2.2) Duration 2019/01/01-2021/12/31

MSPO – International Defence Industry Exhibition 24 września 2021

MSPO – International Defence Industry ExhibitionMSPO – International Defence Industry ExhibitionMSPO – International Defence Industry ExhibitionMSPO – International Defence Industry Exhibition

Date: 7th-10th September, 2021

Place: Kielce

This trade fair was the 29th edition of the exhibition. It was a time for promoting the project results as well as making contact with potential customers and future Project Partners. Representatives of the 3DMPWire project showed the Cu based wires (feedstock for 3D printing) produced at Łukasiewicz – Institute of Non-Ferrous Metals, printed samples, and the marine propeller. They also took part in many meetings discussing the possibilities of cooperation.

Project Partners

Łukasiewicz Research Network - Institute of Non-Ferrous Metals

  • Development of the Cu-based alloys
  • Development of production technology of feedstock materials for WAAM
  • Wire arc additive manufacturing at laboratory scale
  • Materials investigations

Ghent University

  • Corrosion-fatigue investigations
  • Tests of the prototypes in seawater environment
  • Educational activities

Italian National Agency for New Technologies, Energy and Sustainable Economic Development

  • Material investigations
  • Mechanical proporties

Gefertec GmbH

  • Development of the production process parameters by means of 3DMP technology
  • Implementation of the results of the project (end user)
  • Manufacturing of the new products

Tecnalia Research and Innovation

  • Erosion tests
  • Non-destructive tests

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