Material-efficient Cu wire-based 3D printing technology
Area Acceleration (D2) Segment Upscaling (D2.2) Duration 2019/01/01-2021/12/31
Material-efficient Cu wire-based 3D printing technology
Area Acceleration (D2) Segment Upscaling (D2.2) Duration 2019/01/01-2021/12/31
Date: 26-28 November, 2019 Place: Graz, Austria This meeting was a time for presentations of projects, of ECLC Strategy, and…
Date: 18-19 September, 2019 Place: Wrocław, Poland Our colleagues had a chance to take part in the Additive Manufacturing Meeting…
Date: 20-24 October, 2019 Place: Taipei, Taiwan This conference is a big international event concerning the topic of materials and…
Date: 19-21 October, 2019 Place: Frankfurt, Germany Formnext is a leading global trade fair dedicated to additive manufacturing and industrial…
Date: 26 September, 2019 Place: ENEA Faenza Laboratories (Italy) The 26th September 2019 “Materializzando OFF” took place in Faenza. This…
Date: 17 October, 2019 Place: Łukasiewicz Research Network – Institute of Non-Ferrous Metals, Gliwice A meeting with The Głogów Copper…
