Material-efficient Cu wire-based 3D printing technology

Area Acceleration (D2) Segment Upscaling (D2.2) Duration 2019/01/01-2021/12/31

RawD TRIP 4 września 2019

Date: 3 September, 2019
Place: the Łukasiewicz – IMN, Gliwice

On the 3rd of September we had the pleasure to host a meeting with a group of international students at our Institute. It was part of the RawD TRIP, EIT RawMaterials Academy. During the first part of the meeting our colleagues gave presentations on the Institute and its activity, Metallurgy of Copper, Additive Manufacturing and the 3DMPWire project.
Later our guests had a chance to visit the laboratories and see a demonstration of the WAAM technique (3DMP® process) and melting and casting of Cu based alloys.

Project Partners

Łukasiewicz Research Network - Institute of Non-Ferrous Metals

  • Development of the Cu-based alloys
  • Development of production technology of feedstock materials for WAAM
  • Wire arc additive manufacturing at laboratory scale
  • Materials investigations

Ghent University

  • Corrosion-fatigue investigations
  • Tests of the prototypes in seawater environment
  • Educational activities

Italian National Agency for New Technologies, Energy and Sustainable Economic Development

  • Material investigations
  • Mechanical proporties

Gefertec GmbH

  • Development of the production process parameters by means of 3DMP technology
  • Implementation of the results of the project (end user)
  • Manufacturing of the new products

Tecnalia Research and Innovation

  • Erosion tests
  • Non-destructive tests

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