Material-efficient Cu wire-based 3D printing technology

Area Acceleration (D2) Segment Upscaling (D2.2) Duration 2019/01/01-2021/12/31

Research to Business (R2B) Fairs 20 sierpnia 2019

Date: 6 June, 2019

Place: Bologna, Italy

This event was a chance to hold meetings with companies and exchange ideas and for example present technologies. ENEA had 4 meetings with Italian companies (Innovat&Match 2019 programme).
During the meetings we presented 3DMPWIRE project to each company, providing also a brochure where the project roll-up was showed.

Project Partners

Łukasiewicz Research Network - Institute of Non-Ferrous Metals

  • Development of the Cu-based alloys
  • Development of production technology of feedstock materials for WAAM
  • Wire arc additive manufacturing at laboratory scale
  • Materials investigations

Ghent University

  • Corrosion-fatigue investigations
  • Tests of the prototypes in seawater environment
  • Educational activities

Italian National Agency for New Technologies, Energy and Sustainable Economic Development

  • Material investigations
  • Mechanical proporties

Gefertec GmbH

  • Development of the production process parameters by means of 3DMP technology
  • Implementation of the results of the project (end user)
  • Manufacturing of the new products

Tecnalia Research and Innovation

  • Erosion tests
  • Non-destructive tests

Supported by

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