Material-efficient Cu wire-based 3D printing technology

Area Acceleration (D2) Segment Upscaling (D2.2) Duration 2019/01/01-2021/12/31

Kick off Meeting: The official meeting starting the 3DMPWire. Material-efficient Cu wire-based 3D printing technology project 6 czerwca 2019

Kick off Meeting: The official meeting starting the 3DMPWire. Material-efficient Cu wire-based 3D printing technology projectKick off Meeting: The official meeting starting the 3DMPWire. Material-efficient Cu wire-based 3D printing technology projectKick off Meeting: The official meeting starting the 3DMPWire. Material-efficient Cu wire-based 3D printing technology projectKick off Meeting: The official meeting starting the 3DMPWire. Material-efficient Cu wire-based 3D printing technology projectKick off Meeting: The official meeting starting the 3DMPWire. Material-efficient Cu wire-based 3D printing technology projectKick off Meeting: The official meeting starting the 3DMPWire. Material-efficient Cu wire-based 3D printing technology projectKick off Meeting: The official meeting starting the 3DMPWire. Material-efficient Cu wire-based 3D printing technology projectKick off Meeting: The official meeting starting the 3DMPWire. Material-efficient Cu wire-based 3D printing technology projectKick off Meeting: The official meeting starting the 3DMPWire. Material-efficient Cu wire-based 3D printing technology projectKick off Meeting: The official meeting starting the 3DMPWire. Material-efficient Cu wire-based 3D printing technology projectKick off Meeting: The official meeting starting the 3DMPWire. Material-efficient Cu wire-based 3D printing technology projectKick off Meeting: The official meeting starting the 3DMPWire. Material-efficient Cu wire-based 3D printing technology projectKick off Meeting: The official meeting starting the 3DMPWire. Material-efficient Cu wire-based 3D printing technology project

Date: 30 May, 2019

Place: ŁUKASIEWICZ Research Network – Institute of Non-Ferrous Metals, Gliwice

An official meeting to start the 3DMPWire. Material-efficient Cu wire-based 3D printing technology project was held. The project is funded by EIT Raw Materials and our Institute is the leader of it. The meeting was attended by representatives of the members of the Consortium: Tecnalia (Spain) – Patricia Caballero, Gefertec GmbH (Germany) – Georg Fischer, ENEA (Italy) – Matteo Scafe and Giuseppe Magnani, and Ghent University (Belgium) – Wim De Waele.

Project Partners

Łukasiewicz Research Network - Institute of Non-Ferrous Metals

  • Development of the Cu-based alloys
  • Development of production technology of feedstock materials for WAAM
  • Wire arc additive manufacturing at laboratory scale
  • Materials investigations

Ghent University

  • Corrosion-fatigue investigations
  • Tests of the prototypes in seawater environment
  • Educational activities

Italian National Agency for New Technologies, Energy and Sustainable Economic Development

  • Material investigations
  • Mechanical proporties

Gefertec GmbH

  • Development of the production process parameters by means of 3DMP technology
  • Implementation of the results of the project (end user)
  • Manufacturing of the new products

Tecnalia Research and Innovation

  • Erosion tests
  • Non-destructive tests

Supported by

2019 © Material-efficient Cu wire-based 3D printing technology | All rights reserved
Agencja Interaktywna ITOWN - profesjonalne strony www