Working with Gefertec - 3DMPWIRE - Material-efficient Cu wire-based 3D printing technology

Date: 13-16 July

Place: Berlin

This week was a time of intense joint work of two of the Project Partners – Gefertec and the Ł-IMN. It took place at Gefertec, in Germany. During this time new wires were tested and work on optimising the printing parametres was carried out.

Working on a new group feedstock materials for WAAM

28th International Defence Industry Exhibition MSPO

Project Partners

Łukasiewicz Research Network - Institute of Non-Ferrous Metals

Development of the Cu-based alloys
Development of production technology of feedstock materials for WAAM
Wire arc additive manufacturing at laboratory scale
Materials investigations

Ghent University

Corrosion-fatigue investigations
Tests of the prototypes in seawater environment
Educational activities

Italian National Agency for New Technologies, Energy and Sustainable Economic Development

Material investigations
Mechanical proporties

Gefertec GmbH

Development of the production process parameters by means of 3DMP technology
Implementation of the results of the project (end user)
Manufacturing of the new products

Tecnalia Research and Innovation

Erosion tests
Non-destructive tests

Working with Gefertec 16 lipca 2020